Microvias are used as the interconnects between layers in high density interconnect (HDI) substrates and printed circuit boards (PCBs) to accommodate... 10 KB (1,344 words) - 18:38, 4 February 2024 |
Via (electronics) (redirect from Microvia filling) tube or a rivet.[citation needed] High-density multilayer PCBs may have microvias: blind vias are exposed only on one side of the board, while buried vias... 15 KB (1,625 words) - 15:39, 30 March 2024 |
 | incorporated in different devices. In 1995 PCB manufacturers began using microvia technology to produce High-Density Interconnect (HDI) PCBs. Recent advances... 86 KB (10,936 words) - 23:57, 4 April 2024 |
 | Copper Plating Process Using the Taguchi Experimental Design Method: I. Microvia Filling by Copper Plating Using Dual Levelers". Journal of the Electrochemical... 24 KB (2,640 words) - 02:05, 12 February 2024 |
D'Amico, J.F.; Blumenstock, B.J.; DeAngelo, M.A. (1990). "Laser drilling of microvias in epoxy-glass printed circuit boards". IEEE Transactions on Components... 18 KB (2,438 words) - 13:49, 20 February 2024 |
2007.11.001. PMC 2254523. PMID 18155859. Verdant Electronics Homepage Microvias HDI PCB Fabrication Download link - White paper on the Occam process... 5 KB (672 words) - 00:39, 4 April 2024 |